Redistribution Layer Preparation on Glass Panel for Panel Level Fan Out Package by Photosensitive Polyimide
Masuda, Yuki, Hashimoto, Keika, Shoji, Yu, Koyama, Yutaro, Tomikawa, MasaoVolume:
31
Langue:
english
Journal:
Journal of Photopolymer Science and Technology
DOI:
10.2494/photopolymer.31.629
Date:
June, 2018
Fichier:
PDF, 3.67 MB
english, 2018