
[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Modal analysis of reflection of TDR in overhead distribution lines
Matsushima, Tohlu, Hisakado, Takashi, Wada, Osami, Oe, Shinpei, Sasaoka, TsuyoshiAnnée:
2018
DOI:
10.1109/ISEMC.2018.8393833
Fichier:
PDF, 218 KB
2018