[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Efficient analysis of ESD noise coupling to mobile device memory module
Yousaf, Jawad, Lee, Hosang, Park, Myeongko, Nah, Wansoo, Youn, Jinsung, Lee, Daehee, Hwang, ChanseokAnnée:
2018
Langue:
english
DOI:
10.1109/ISEMC.2018.8393978
Fichier:
PDF, 1.53 MB
english, 2018