[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - RFI suppression and throughput improvement of WiFi performance with graphene coating for converging mobile device
Wu, Cheng-Hau, Lin, Han-Nien, Fu, Jing-Wen, Lin, Jeffrey Yen-Ting, Lin, Min-Shang, Su, Chia-HungAnnée:
2018
Langue:
english
DOI:
10.1109/ISEMC.2018.8393778
Fichier:
PDF, 1.02 MB
english, 2018
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