[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-Bonded Device Assembly
Chyan, O., Ross, N., Asokan, M., Lambert, A., Berhe, S., Chowdhury, M., Connor, S. O., Nguyen, L.Année:
2017
Langue:
english
DOI:
10.1109/ECTC.2017.43
Fichier:
PDF, 1.22 MB
english, 2017