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[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Heterogeneous integration toward monolithic 3D chip
Kim, SangHyeon, Kim, Seong-Kwang, Shim, Jae-Phil, Geum, Dae-myeong, Ju, Gunwu, Kim, Han Sung, Lim, Hee Jung, Lim, Hyeong Rak, Han, Jae-Hoon, Kang, ChangMo, Lee, Dong Seon, Song, Jin Dong, Choi, Won JuAnnée:
2017
Langue:
english
DOI:
10.1109/S3S.2017.8309242
Fichier:
PDF, 1.10 MB
english, 2017