[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Research of via about signal integrity facing complete transmission path
Huang, Gen-xin, Huang, Chun-yue, Han, Li-shuai, Yin, Rui, Lu, Liang-kun, Li, Tian-ming, Liang, YingAnnée:
2017
Langue:
english
DOI:
10.1109/ICEPT.2017.8046508
Fichier:
PDF, 925 KB
english, 2017