[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Strip warpage assessment of dual side molding SiP module
Wang, Ming-Han, Hu, Ian, Chen, Richard Y C, Yeh, Chan-Lin, Shih, Meng-Kai, Tarng, DavidAnnée:
2017
Langue:
english
DOI:
10.1109/EPTC.2017.8277508
Fichier:
PDF, 664 KB
english, 2017