[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - New desmear process of organic substrate applications by Photodesmear technology
Endo, Shinichi, Habu, Tomoyuki, Kikuiri, Hajime, Aiba, Akira, Miura, Masaki, Horibe, Hiroki, Suzuki, Hiroko, Yabu, ShintaroAnnée:
2017
DOI:
10.1109/IMPACT.2017.8255908
Fichier:
PDF, 1.26 MB
2017