[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Modelling of wire bonding Cu-Al intermetallic formation growth towards interfacial stress
Chia, Lee Cher, Yau, Chua Kok, Anand, T. Joseph Sahaya, Shariza, S., Jamli, Mohamad Ridzuan BinAnnée:
2017
Langue:
english
DOI:
10.1109/EPTC.2017.8277465
Fichier:
PDF, 621 KB
english, 2017