Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry
Luo, Li, Zhang, Shengtao, Qiang, Yujie, Bozdag, Ismail, Chen, Shijin, Tang, Mingxing, Gao, Jingyao, Qin, ZhongjianLangue:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1080/01694243.2017.1423159
Date:
January, 2018
Fichier:
PDF, 2.44 MB
english, 2018