Statistical Distribution of Through-Silicon via Cu Pumping
De Messemaeker, Joke, Roussel, Philippe J., Pedreira, Olalla Varela, Van der Donck, Tom, Van Huylenbroeck, Stefaan, Beyne, Eric, De Wolf, Ingrid, Stucchi, Michele, Croes, KristofVolume:
17
Langue:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2017.2738154
Date:
September, 2017
Fichier:
PDF, 2.67 MB
english, 2017