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Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing
Wang, Yan, Han, Jing, Wang, Yishu, Ma, Limin, Guo, FuVolume:
47
Langue:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5774-4
Date:
January, 2018
Fichier:
PDF, 1.88 MB
english, 2018