[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics