
Heat dissipation analysis of continuously-moving plate undergoing thermal processing using laplace Adomian decomposition method
Chen, Chao Kuang, Chang, Yu-Shen, Liu, Chin-Chia, Chen, Bang-Shiuh, Wang, Cheng-Chi, Li, ChenfengLangue:
english
Journal:
Engineering Computations
DOI:
10.1108/EC-04-2017-0150
Date:
August, 2017
Fichier:
PDF, 1.05 MB
english, 2017