Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys
Silva, Bismarck L., Xavier, Marcella G.C., Garcia, Amauri, Spinelli, José E.Langue:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2017.08.059
Date:
August, 2017
Fichier:
PDF, 4.24 MB
english, 2017
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