Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
Chang, Hung-Jen, Chou, Jung-Hua, Chang, Tao-Chih, Zhan, Chau-Jie, Hon, Min-Hsiung, Hsi, Chi-ShiungVolume:
133
Année:
2011
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4003989
Fichier:
PDF, 2.59 MB
english, 2011