[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of wire material and fluorine in dielectric on wire Pull Test stress
Sethu, Raj Sekar, Schirrmann, Christian, Ha, How Ung, Soon, Kok HengAnnée:
2017
Langue:
english
DOI:
10.1109/EuroSimE.2017.7926227
Fichier:
PDF, 27.38 MB
english, 2017