[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A study on device robustness with integrated effects from low parts-per-billion level of metallic elements in wafer cleaning process chemicals
Tan, K. H. Raymond, Liew, P. L. Emily, Chin, Chai Chin, Wong, C. Y. JoanneAnnée:
2016
Langue:
english
DOI:
10.1109/ipfa.2016.7564295
Fichier:
PDF, 620 KB
english, 2016