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Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias
Lu, Qijun, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue, Li, YuejinAnnée:
2017
Langue:
english
Journal:
IEEE Transactions on Nanotechnology
DOI:
10.1109/TNANO.2017.2708509
Fichier:
PDF, 1.54 MB
english, 2017