[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - A wet process to etch arrayed vias for through silicon via application of 3D packaging
Gao, Lanya, Zhang, Junhong, Zheng, Shuai, Zhang, Shanshan, Li, MingAnnée:
2016
Langue:
english
DOI:
10.1109/icept.2016.7583379
Fichier:
PDF, 460 KB
english, 2016