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Improving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading
Laurvick, Tod V., Coutu, Ronald A.Volume:
7
Langue:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2600482
Date:
March, 2017
Fichier:
PDF, 2.37 MB
english, 2017