[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints
Sayama, Toshihiko, Takayanagi, Takeshi, Nagai, Yoshiaki, Mori, Takao, Yu, QiangAnnée:
2003
Langue:
english
DOI:
10.1115/ipack2003-35096
Fichier:
PDF, 1.00 MB
english, 2003