[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI, USA (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Impact of fiber weaves on 56 Gbps SerDes interface in glass epoxy packages
Durgun, Ahmet C., Aygun, KemalAnnée:
2016
Langue:
english
DOI:
10.1109/EDAPS.2016.7874431
Fichier:
PDF, 292 KB
english, 2016