[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Adhesive enabling technology for directly plating copper onto glass
Mukai, Kenichiroh, Magaya, Tafadzwa, Brandt, Lutz, Liu, Zhiming, Fu, Hailuo, Hunegnaw, SaraAnnée:
2014
Langue:
english
DOI:
10.1109/IMPACT.2014.7048460
Fichier:
PDF, 1.49 MB
english, 2014