[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
Long, Yangyang, Dencker, Folke, Schneider, Friedrich, Emde, Benjamin, Li, Chun, Hermsdorf, Jorg, Wurz, Marc, Twiefel, JensAnnée:
2016
Langue:
english
DOI:
10.1109/EPTC.2016.7861512
Fichier:
PDF, 3.61 MB
english, 2016