Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
Xie, Weidong, Sitaraman, Suresh K.Volume:
122
Année:
2000
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.483133
Fichier:
PDF, 119 KB
english, 2000