AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - Characterization Of Deformation Properties Of Metals In 3D ICs
Wittler, Olaf, Mroßko, Raul, Huber, Saskia, Dowhan, Lukasz, Lang, Klaus-DieterAnnée:
2011
Langue:
english
DOI:
10.1063/1.3615696
Fichier:
PDF, 46.76 MB
english, 2011