Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
Han, Bongtae, Kim, Dae-SukVolume:
139
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4035598
Date:
January, 2017
Fichier:
PDF, 2.24 MB
english, 2017