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[IEEE 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Georgetown, Penang, Malaysia (2016.9.20-2016.9.22)] 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - An investigation on micro-via drilling on ceramic substrates by a picosecond laser
Hsu, Hsiang-Chen, Wu, Shih-JehAnnée:
2016
Langue:
english
DOI:
10.1109/IEMT.2016.7761911
Fichier:
PDF, 353 KB
english, 2016