[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Large Panel Level Fan Out Package Built up Study with Film Type Encapsulation Material
Takahashi, Hiroshi, Noma, Hirokazu, Suzuki, Naoya, Nomura, Yutaka, Kasahara, Aya, Takano, Nozomu, Nonaka, ToshihisaAnnée:
2016
Langue:
english
DOI:
10.1109/ectc.2016.173
Fichier:
PDF, 634 KB
english, 2016