Possibility of employing thermal stresses as a cutting device for brittle materials.
IMAI, Yasufumi, MORITA, Hideki, TAKASE, Tooru, KOGA, HiroyukiVolume:
55
Année:
1989
Journal:
Transactions of the Japan Society of Mechanical Engineers Series A
DOI:
10.1299/kikaia.55.147
Fichier:
PDF, 604 KB
1989