
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
Geczy, Attila, Fejos, Márta, Tersztyánszky, LászlóVolume:
27
Langue:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-07-2014-0014
Date:
April, 2015
Fichier:
PDF, 498 KB
english, 2015