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Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles
Dai, Xiaoping, Wang, Yangang, Wu, Yibo, Luo, Haihui, Liu, Guoyou, Li, Daohui, Jones, SteveLangue:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.063
Date:
September, 2016
Fichier:
PDF, 1.72 MB
english, 2016