Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)
Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-QuanVolume:
45
Langue:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4739-3
Date:
November, 2016
Fichier:
PDF, 3.21 MB
english, 2016