SPIE Proceedings [SPIE Integrated Optoelectronics Devices - San Jose, CA (Saturday 25 January 2003)] Photonics Packaging and Integration III - Hybrid integration of III-V optoelectronic devices on Si platform using BCB
Katsnelson, Alexei, Tokranov, Vadim E., Yakimov, Michael, Lamberti, Matthew, Oktyabrsky, Serge, Heyler, Randy A., Robbins, David J., Jabbour, Ghassan E.Volume:
4997
Année:
2003
Langue:
english
DOI:
10.1117/12.479453
Fichier:
PDF, 464 KB
english, 2003