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Microstructural investigation of through-silicon via fabrication by pulse-reverse electroplating for high density nanoelectronics
Lin, Nay, Miao, Jianmin, Preisser, RobertVolume:
11
Année:
2014
Langue:
english
Journal:
International Journal of Nanotechnology
DOI:
10.1504/ijnt.2014.059821
Fichier:
PDF, 5.57 MB
english, 2014