SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Advances in Resist Materials and Processing Technology XXVII - Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node
Metz, Andrew, Allen, Robert D., Dunn, Shannon, Hetzer, Dave, Cantone, Jason, Kawakami, Shinichiro, Winter, Tom, Petrillo, Karen, Horak, Dave, Fan, Susan, Colburn, MatthewVolume:
7639
Année:
2010
Langue:
english
DOI:
10.1117/12.846625
Fichier:
PDF, 1.50 MB
english, 2010
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