SPIE Proceedings [SPIE Photonics Asia 2007 - Beijing, China (Sunday 11 November 2007)] Infrared Materials, Devices, and Applications - Innovative on-chip packaging applied to uncooled IRFPA
Dumont, Geoffroy, Cai, Yi, Gong, Haimei, Arnaud, Agnès, Imperinetti, Pierre, Chatard, Jean-Pierre, Mottin, Eric, Simoens, François, Vialle, Claire, Rabaud, Wilfried, Grand, Gilles, Baclet, NathalieVolume:
6835
Année:
2007
Langue:
english
DOI:
10.1117/12.756719
Fichier:
PDF, 1.10 MB
english, 2007