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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Investigation of thermal cycling maximum temperature effect on fatigue life of WLCSP
Min-Hsuan Hsu,, Chiang, Kuo-NingAnnée:
2016
Langue:
english
DOI:
10.1109/icep.2016.7486771
Fichier:
PDF, 669 KB
english, 2016