[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Thermal compression bonding for power IC attachment using pure Zn
Fan, Chih-Hao, Wu, Ting-Jui, Song, Jenn-MingAnnée:
2016
Langue:
english
DOI:
10.1109/icep.2016.7486858
Fichier:
PDF, 912 KB
english, 2016