SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS - Paris, France (Tuesday 9 May 2000)] Design, Test, Integration, and Packaging of MEMS/MOEMS - Packaged bulk micromachined resonant force sensor for high-temperature applications
Haueis, Martin, Dual, Jurg, Cavalloni, Claudio, Gnielka, M., Buser, Rudolf A., Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew A. O.Volume:
4019
Année:
2000
Langue:
english
DOI:
10.1117/12.382278
Fichier:
PDF, 1.04 MB
english, 2000
File converter
Plus de résultats de recherche
More benefits 
