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[IEEE 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Brasov, Romania (2015.10.22-2015.10.25)] 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Palavesam, Nagarajan, Bonfert, Detlef, Hell, Waltraud, Landesberger, Christof, Gieser, Horst, Kutter, Christoph, Bock, KarlheinzAnnée:
2015
Langue:
english
DOI:
10.1109/siitme.2015.7342355
Fichier:
PDF, 1.59 MB
english, 2015