
Study on Characteristic of Material Removal Rate in Chemical Mechanical Polishing of Silicon Wafer
Su, Jianxiu, Chen, Xiqu, Zhang, Xueliang, Du, Jiaxi, Guo, DongmingVolume:
5
Langue:
english
Journal:
Journal of Computational and Theoretical Nanoscience
DOI:
10.1166/jctn.2008.844
Date:
August, 2008
Fichier:
PDF, 650 KB
english, 2008