[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Numerical analysis on MUF process for flip chip packaging
Cheng, Xiyun, Wang, Qian, Tan, Lin, Li, Guanhua, Chen, Yu, Cai, JianAnnée:
2014
Langue:
english
DOI:
10.1109/isaf.2014.6917959
Fichier:
PDF, 1.36 MB
english, 2014