[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Design of a thermal sensitive MEMS resonator and readout circuit for infrared sensing
Lin, Yu-Sheng, Hsu, Feng-Chia, Hsu, Chung-Yi, Sun, Shang-Ching, Chiu, Sheng-Ren, Chen, Hong-RenAnnée:
2015
Langue:
english
DOI:
10.1109/impact.2015.7365219
Fichier:
PDF, 2.63 MB
english, 2015