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Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging
Wu, Guanglei, Cheng, Yonghong, Wang, Kuikui, Wang, Yiqun, Feng, AilingVolume:
27
Langue:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4464-y
Date:
June, 2016
Fichier:
PDF, 1.52 MB
english, 2016