[IEEE 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) - Shanghai, China (2016.1.24-2016.1.28)] 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) - Wafer-level shellac-based interconnection process for ultrathin silicon chips of arbitrary shape
Barz, Falk, Lausecker, Roland, Wallrabe, Ulrike, Ruther, Patrick, Paul, OliverAnnée:
2016
Langue:
english
DOI:
10.1109/memsys.2016.7421676
Fichier:
PDF, 1.17 MB
english, 2016