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[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Characterization studies of non-stick on pad (NSOP) using AES, XPS and TOF-SIMS
Younan, Hua, Yixin, Chen, Jingjing, Shao, Meng, Hao, Yue, Shen, Zhenxiang, Xing, Yang, Feng, Chao, Fu, Xiaomin, LiAnnée:
2014
Langue:
english
DOI:
10.1109/iemt.2014.7123076
Fichier:
PDF, 2.39 MB
english, 2014