
Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation
Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.Volume:
28
Langue:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2015.2438875
Date:
August, 2015
Fichier:
PDF, 4.36 MB
english, 2015